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New lab positions Singapore as a global leader in semiconductor R&D

Zafar Anjum | March 8, 2012
Applied Materials and A*STAR’s Institute of Microelectronics open dedicated lab to drive advanced 3D chip packaging.

Conceived to support research collaboration between Applied Materials and IME, the Centre will also allow both parties to pursue independent research initiatives including process engineering, integration and hardware development.

The Centre also serves as a demonstration of how A*STAR is able to develop and nurture a local ecosystem for advanced R&D through partnerships with leading corporations. Research activities are already underway with a team of more than 50 personnel. 

"The Centre of Excellence is a prime example of a strategic relationship fostered between two leading players in the global semiconductor value chain and will spur the development of innovative wafer-level packaging technologies to be implemented globally," said Professor Dim-Lee Kwong, executive director of IME. "This collaboration will enable the semiconductor industry to accelerate the adoption of 3D chip packaging."



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